Awarded

Hybrid Wafer Bonding

Name: Hybrid Wafer Bonding
Creator: Silicon Austria Labs GmbH
Published: 2026-08-05
License: https://ted.europa.eu/en/simap/legal-notice

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Buyer: Silicon Austria Labs GmbH
Winners: EV Group Europe & Asia/Pacific GmbH
Contract value: €2,797,834
Bids received: 1
Published: 5 Aug 2026
Awarded: 20 Jul 2026
Contract start: 20 Jul 2026
Contract end: 18 Nov 2026estimated
Sector: Laboratory and optical equipment
Region: Klagenfurt-Villach
Source: Original notice on TED (546056-2026)

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