Awarded

Lote 3: Equipo de soldadura de chip de cara a baile (Flip-Chip Bonder) de hasta 10 μm de precisión.

Original language: Spanish

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Contract value
€111,880
Bids received
1
Published
3 Jul 2025
Awarded
1 Jul 2025
Contract start
1 Jul 2025
Contract end
28 Mar 2026estimated
Region
Barcelona

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